COG LCD Module

COG LCD module
COG LCD module ADG12864A17
Model No. ADG12864A17
►128x64 COG display
►Graphic LCD

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Product Details

COG LCD module

COG LCD module ADG12864A17

Model No. ADG12864A17

►128x64 COG display

►Graphic LCD

►Built-in controller Solomon SSD1815BZ

►5V power supply

►1/65 Duty, 1/9 Bias

►Interface : 8-bit Parallel

Description of COG LCD module ADG12864A17

Amotec Display COG LCD module ADG12864A17 is monochrome LCD display module. This COG LCD module has the outline dimension 35.2(W) X25.9(H) X1.75MAX(T) mm and VA size of 32.20MIN X 19.5MIN(H)mm. This series is built in with Solomon SSD1815BZ driver and the interface is 8-bit Parallel. This series of module can be operating at temperatures from -20℃ to +70℃; its storage temperatures range from -30℃ to +80℃.

1. FEATURES

The features of LCD are as follows

* Display mode : FSTN, Positive, Transflective

* Color : Display dot : Black

Background: White

* Display Format : 112Dots × 64Dots

* IC : Solomon SSD1815BZ

* Interface Input Data : 8-bit Parallel

* Driving Method : 1/65 Duty, 1/9 Bias

* Viewing Direction : 6 O’clock

2. MECHANICAL SPECIFICATIONS

Item

Specification

Unit

Module Size

35.2(W) X25.9(H) X1.75MAX(T)

mm

Viewing Area

32.20MIN X 19.5MIN(H)

mm

Effective Display Area

27.41(W) X16.29(H)

mm

Number of Dots

112 X 64Dots

-

Dot Size

0.215(W) X 0.225(H)

mm

Dot Pitch

0.245(W) X 0.255(H)

mm

3. ELECTRICAL SPECIFICATIONS (Continued)

Item

Symbol

Test
Condition

Min.

Typ.

Max.

Unit

Supply Voltage For Logic

VDD - VSS

-

2.4

3.0

3.5

V

Supply Voltage For LCD

VOP=V6-VDD

Ta=25℃

8.7

9.0

9.3

V

Input Voltage

“H” Level

V IH

-

0.8VDD

-

VDD

V

“L” Level

V IL

Vss

-

0.2VDD

V

Output Voltage

“H” Level

V OH

IOH= -0.1mA

0.9VDD

-

VDD

V

“L” Level

V OL

IOL= 0.1mA

0

-

0.1VDD

V

Current Consumption

IDD

VDD–VSS=3.0V

-

0.80

2.0

mA

NOTE: 1) Duty ratio=1/65, Bias=1/9     2) Measured in Dots ON-state

4. POWER SUPPLY


5.jpg

5. ELECTRO – OPTICAL CHARACTERISTICS

Item

Symbol

Temp.

Min.

Typ.

Max.

Unit

Conditions

Note

Viewing
Angle

Θ2 –Θ1

25℃

30

103

-

Deg.

-

1,2

Φ

60

110

-

Contrast
Ratio

Cr

25℃

2

4

-

-

Θ=0°
Φ=0°

3

Response
Time(rise)

Tr

25℃

-

80

250

ms

Θ=0°
Φ=0°

4

0℃

-

950

1150

Response
Time(fall)

Tf

25℃

-

183

250

ms

Θ=0°
Φ=0°

4

0℃

-

950

1150

Note1 . Definition of Angle Θ&Φ

Note2. Definition of Viewing Angle Θ1&Θ2

1(001).jpg

2(001).jpg

Note3 . Definition of Contrast Cr

Note4. Definition of Optical Response

3(001).jpg

4(001).jpg

6. Interface Pin Function

Pin

Symbol

Function

1

CS

Chip select inputs pins

2

/RES

Reset input pin

3

D/C

Register select input ‘H’: Display data, ’L’: Control data

4

WR

When 6800 series MPU,’ H ’: read, ’L’: write

5

RD

8080:active low

6~13

D0~D7

When the serial interface selected (PS = “L”)
D7: serial input data (SDA)
D6: serial input clock (SCK)
D5 to D0: high impedance.
When chip select is not active, DB7 to DB0 will be high impedance.

14

VDD

Power supply

15

VSS

Power ground

16

VOUT(VEE)

Power supply

17

CAP3N

When internal DC-DC voltage converter is used, external capacitor is connected between these pins. Different connection will result in different DC-DC converter multiple factor,2X, 3X or 4X.

18

CAP1P

19

CAP1N

20

CAP2N

21

CAP2P

22~26

VL6~VL2

LCD driving voltages. They can be supplied externally or generated by the internal bias divider. They have the following relationship: VDD>VL2>VL3>VL4>VL5>VL6

27

VSS

Power ground

38

C86

This pin is MCU parallel interface selection input

7. COMMAND LIST

6(001).jpg

7. COMMAND LIST (Continued)

7(001).jpg

Extended Command Table

8(001).jpg

8.TIMING CHARACTERISTICS

8-1.6800 – Series MPU Parallel Interface Timing Characteristics (VDD-VSS=2.4v to 3.5v, Ta=-30 to 85℃)

9(001).jpg

10(001).jpg

8.TIMING CHARACTERISTICS

8-2.8080 – Series MPU Parallel Interface Timing Characteristics (VDD-VSS=2.4v to 3.5v, Ta=-30 to 85℃)

11(001).jpg

12(001).jpg

8.TIMING CHARACTERISTICS

8-3.Serial Interface Timing Characteristics (VDD-VSS=2.4v to 3.5v, Ta=-30 to 85℃)

13(001).jpg

14(001).jpg

9. QUALITY SPECIFICATION

9 - 1. LCM Appearance and Electric inspection Condition

1.Inspection will be done by placing LCM 30cm away from inspector's eyeballs under normal illumination.

15.jpg

2.View Angle: with in 45°around perpendicular line.

9 - 2. Definition

1.COB

16.jpg

2.Heat Seal

17.jpg

3.TAB and COG

18.jpg

9. QUALITY SPECIFICATION (Continued)

9-3. Sampling Plan and Acceptance

1.Sampling Plan

MIL - STD - 105E (‖) ordinary single inspection is used.

2.Acceptance

Major defect: AQL = 0.25%

Minor defect: AQL = 0.65%

9-4. Criteria

1.COB

Defect

Inspection Item

Inspection Standards

Major

PCB copper flakes peeling off

Any copper flake in viewing Area should be greater than 1.0mm2

Reject

Major

Height of coating epoxy

Exceed the dimension of drawing

Reject

Major

Void or hole of coating epoxy

Expose bonding wire or IC

Reject

Major

PCB cutting defect

Exceed the dimension of drawing

Reject

2.SMT

Defect

Inspection Item

Inspection Standards

Minor

Component marking not readable

 

Reject

Minor

Component height

Exceed the dimension
Of drawing

Reject

Major

Component solder defect (missing, extra, wrong component or wrong orientation

 

Reject

Minor

Component position shift
1.jpg

X < 3/4Z Y > 1/3D

Reject  Reject

Minor

Component tilt
2.jpg

Y > 1/3D

Reject

Minor

Insufficient solder
3.jpg

θ< 20°

Reject

9-4. Criteria (Continued)

3. Metal (Plastic) Frame

Defect

Inspection Item

Inspection Standards

Major

Crack / breakage

Anywhere

Reject

Minor

Frame Scratch

W

L

Acceptable of Scratch

w<0.03mm

Any

Ignore

0.03mm<w<0.05mm

L<5.0mm

2

0.05mm<w<0.1mm

L<3.0mm

1

w>0.1mm

Any

0

Note: 1. Above criteria applicable to scratch lines with distance greater than 5mm.
2. Scratch on the back side of frame (not visible) can be ignored.

Minor

Frame Dent, Prick
1.jpg

 

Acceptable of Dents / Pricks

Φ<1.0mm

2

1.0<Φ<1.5mm

1

1.5mm>Φ

0

Note: 1. Above criteria applicable to any two dents / pricks with distance greater than 5mm
2. Dent / prick on the back side of frame (not visible) can be ignored

Minor

Frame Deformation

Exceed the dimension of drawing

Minor

Metal Frame Oxidation

Any rust

4. Flexible Film Connector (FFC)

Defect

Inspection Item

Inspection Standards

Minor

Tilted soldering

Within the angle +3°

Acceptable

Minor

Uneven solder joint /bump

 

Reject

Minor

Hole

1.jpg

Expose the conductive line

Reject

Φ > 1.0mm

Reject

Minor

Position shift
2.jpg

Y > 1/3D

Reject

X > 1/2Z

Reject

9-4. Criteria (Continued)

5. Screw

Defect

Inspection Item

Inspection Standards

Major

Screw missing/loosen

 

Reject

Minor

Screw oxidation

Any rust

Reject

Minor

Screw deformation

Difficult to accept screw driver

Reject

6. Heat seal 、TCP 、FPC

Defect

Inspection Item

Inspection Standards

Major

Scratch expose conductive layer

 

Reject

Minor

HS Hole

1.jpg

Φ> 0.2mm

Reject

Major

Adhesion strength

Less than the specification

Reject

Minor

Position shift
2.jpg

Y > 1/3D

Reject

X > 1/2Z

Reject

Major

Conductive line break

 

Reject

7. LED Backing Protective Film and Others

Defect

Inspection Item

Inspection Standards

Minor

LED dirty, prick

Acceptable number of units

Φ<0.10mm

lgnore

0.10<Φ<0.15mm

2

0.15<Φ<0.2mm

1

Φ>0.2mm

0

The distance between any two spots should be >10mm
Any spot/dot/void outside of viewing area is acceptable

Minor

Protective film tilt

Not fully cover LCD

Reject

Major

COG coating

Not fully cover ITO circuit

Reject

8. Electric Inspection

Defect

Inspection Item

Inspection Standards

Major

Short

 

Reject

Major

Open

 

Reject

9-4. Criteria (Continued)

9.Inspection Specification of LCD

Defect

Inspect Item

Inspection Standards

Minor

Linear Defect

* Glass Scratch
* Polarizer Scratch
* Fiber and Linear material

W

W<0.03

0.03<W<0.05

W>0.05

L

L<5

L<3

Any

ACC. NO.

1

1

Reject

Note

L is the length and W is the width of the defect

Minor

Black Spot and Polarizer Pricked

* Foreign material between glass and polarizer or glass and glass
* Polarizer hole or protuberance by external force

Φ

Φ<0.1

0.1<Φ<0.15

0.15<Φ<0.2

Φ>0.2

ACC. NO.

3EA /1PC

2

1

0

Note

Φ is the average diameter of the defect.
Distance between two defects > 10mm.

Minor

White Spot and Bubble in polarizer

* Unobvious transparant foreign material between glass and glass or glass and polarizer
* Air protuberance between polarizer and glass

Φ

Φ<0.1

0.1<Φ<0.15

0.15<Φ<0.2

Φ>0.2

ACC. NO.

3EA / 1PC

2

1

0

Note

Φ is the average diameter of the defect.
Distance between two defects > 10mm.

Minor

Segment  Defect


1.jpg

Φ

Φ<0.10

0.10<Φ<0.20

Φ>0.2

ACC.NO.

3EA /1PC

2

0

Note

W is more than 1/2 segment width

Reject

5.jpg 
Distance between two defect is 10mm

Minor

Protuberant Segment

2.jpg

Φ

Φ<0.10

0.10<Φ<0.20

Φ>0.2

W

Glue

W<1/2 Seg , W<0.2

Ignore

ACC.NO.

3EA /1PC

2

0

Minor

Assembly
Mis-alignment

3.jpg

1. Segment

B

B<0.4mm

0.4<B<1.0mm

B>1.0mm

B-A

B-A<1/2B

B-A<0.2

B-A<0.25

Judge

Acceptable

Acceptable

Acceptable

4.jpg

2. Dot Matrix

Deformation>0.35mm

Reject

Minor

Stain on LCD Panel Surface

Accept when stains can be wiped lightly with a soft cloth or a similar one. Otherwise, judged according to the above items: “Black spot” and “White Spot”

10. RELIABILITY

NO.

Item

Condition

Criterion

1

High Temperature Operating

70℃, 96Hrs

No defect in cosmetic and operational function allowable.

Total current Consumption should be below double of initial value.

2

Low Temperature Operating

-20℃, 96Hrs

3

High Humidity

60℃, 90%RH, 96Hrs

4

High Temperature Storage

80℃, 96Hrs

5

Low Temperature Storage

-30℃, 96Hrs

6

Vibration

Random wave
10 ~ 100Hz
Acceleration: 2G
60 Minute

7

Thermal Shock

-20℃ to 25℃ to 70℃
(60Min) (15Min)(60Min)
16Cycles

8

ESD Testing

Contract Discharge Voltage:
+1 ~ 5kV and –1 ~ –5kV

There will be discharged ten times at every discharging voltage cycle. The voltage gap is 1kV.

Air Discharge Voltage:
+1 ~ 8kV and –1 ~ -8kV

Note:1) Above conditions are suitable for Amotec standard products.

2) For restrict products, the test conditions listed as above must be revised.

OUTLINE DIMENTION

21.jpg

FAQ

1.What is 8 bits parallel interface ?

In data transmission, parallel communication is a method of conveying multiple binary digits (bits) simultaneously. It contrasts with serial communication, which conveys only a single bit at a time; this distinction is one way of characterizing a communications link.

2.What is Busy Flag (BF) ?

The LCD module needs a process time for any received instruction. Before finishing the received instruction, any further instruction is not accepted. The process time of each instruction is not equal and the internal process is finished or not can be determined by the BF. Internal operation is in progress while BF=”1”, that means module is in busy state. No further instructions will be accepted until BF=”0”. MPU must check BF to determine whether the internal operation is finished or not before issuing instruction.

3.How many LED colors are available for COG LCD module ?

The LED is available in several different backlight colors including blue, green, white, yellow-green, amber, red, white, and RGB.

4.What are the types of LCD polarizers?

These are the three types of LCD polarizers: Reflective, Transflective, and Transmissive. The correct polarizer is determined by the different lighting conditions your product will operate in or be exposed to.

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