Dot Matrix LCD

dot matrix LCD
dot matrix LCD ADG12832A3
Model No. ADG12832A3
►128x32 COG display
►Graphic LCD

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Product Details

dot matrix LCD

dot matrix LCD ADG12832A3

Model No. ADG12832A3

►128x32 COG display

►Graphic LCD

►Built-in controller ST7567-G4

►5V power supply

►1/33 Duty, 1/6 Bias

►Interface : Serial 4-Line SPI Interface MPU

Description of dot matrix LCD ADG12832A3

The dot matrix LCD ADG12832A3 is a 128x32 COG monochrome Graphic LCD module. This LCD module is built in with ST7567-G4 controller or equivalent IC.The dot matrix LCD ADG12832A3 supports Serial 4-Line SPI Interface MPU. This dot matrix LCD COG 128x32 display is very suitable for the applications that demand more compact package displays.

1. FEATURES

The features of LCD are as follows

* Display mode: FSTN, Positive, Transflective

* Color: Display dot: Black

Background: White

* Display Format: 128 Dots × 32 Dots graphic

* IC: ST7567-G4

* Interface Input Data: Serial 4-Line SPI Interface MPU

* Driving Method: 1/33 Duty, 1/6 Bias

* Viewing Direction: 12 O’clock

* Backlight: White

* LCM technological conditions: RoHS

2. MECHANICAL SPECIFICATIONS

Item

Specification

Unit

Module Size

74(W) X35(H) X 4.5MAX(T)

mm

Viewing Area

63.9MIN(W) X 15.6MIN(H)

mm

Effective Display Area

60.9MIN(W) X 13.42MIN(H)

mm

Number of Dots

128 X 32Dots

-

Dot Size

0. 4(W) X 0.4H)

mm

Dot Pitch

0.42(W) X 0.42(H)

mm

3. ELECTRICAL SPECIFICATIONS (Continued)

3-2-1.Electrical Characteristics

Item

Symbol

Test  Condition

Min.

Typ.

Max.

Unit

Supply Voltage For Logic

VDD – VSS

Ta=25℃

1.8

3.1

3.3

V

Supply Voltage For LCD

VDD – V5

Ta=25℃

5.8

6.0

6.3

V

Input Voltage

“H” Level

V IH

Ta=25℃

0.8VDD

 

VDD

V

“L” Level

V IL

VSS

 

0.2VDD

V

Output Voltage

“H” Level

V OH

IOUT= -0.1mA

0.8VDD

-

VDD

V

“L” Level

V OL

IOUT= 0.1mA

VSS

-

0.2VDD

V

Current Consumption

IDD

VIN = VDD

-

0.70

1.0

mA

NOTE: 1) Duty ratio=1/33, Bias=1/6  2) Measured in Dots ON-state

3-3.Backlight

1.jpg

4. POWER SUPPLY

2.jpg

5. ELECTRO – OPTICAL CHARACTERISTICS

Item

Symbol

Temp.

Min.

Typ.

Max.

Unit

Conditions

Note

Viewing
Angle

Θ2 –Θ1

25℃

30

70

-

Deg.

-

1,2

Φ

50

50

-

Contrast
Ratio

Cr

25℃

2

6

-

-

Θ=0°
Φ=0°

3

Response
Time(rise)

Tr

25℃

-

81

250

ms

Θ=0°
Φ=0°

4

0℃

-

950

1150

Response
Time(fall)

Tf

25℃

-

167

250

ms

Θ=0°
Φ=0°

4

0℃

-

950

1150

Note1. Definition of Angle Θ&Φ

Note2.Definition of Viewing Angle Θ1&Θ2

3(001).jpg

4(001).jpg

Note3. Definition of Contrast Cr

Note4.Definition of Optical Response

5(001).jpg

6(001).jpg

6. Interface Pin Function

Pin NO.

Symbol

I / O

Functions

1

CSB

I

Chip select input pin.

2

RSTB

I

Hardware reset input pin.

3

A0

I

It determines whether the access is related to data or command.

4

SCLK

I

Serial clock input.

5

SDA

I

Serial data input.

6

VDD

Power

Logic power supply

7

VSS

Power

Ground

8

V0

Power

V0 is the LCD driving voltage for common circuits at negative frame.

9

XV0

Power

XV0 is the LCD driving voltage for common circuits at positive frame.

10

VG

Power

VG is the LCD driving voltage for segment circuits.

11

A+

Power

Backlight  A+

12

K-

Power

Backlight  k-

7. COMMAND LIST

7(001).jpg

9. QUALITY SPECIFICATION

9 - 1. LCM Appearance and Electric inspection Condition

1.Inspection will be done by placing LCM 30cm away from inspector's eyeballs under normal illumination.


8.jpg

2.View Angle: with in 45°around perpendicular line.

9 - 2. Definition

1.COB 

9.jpg

2.Heat Seal

10.jpg

3.TAB and COG

11.jpg

9. QUALITY SPECIFICATION (Continued)

9-3. Sampling Plan and Acceptance

1.Sampling Plan

MIL - STD - 105E (‖) ordinary single inspection is used.

2.Acceptance

Major defect: AQL = 0.25

Minor defect: AQL = 0.65

9-4. Criteria

1.COB

Defect

Inspection Item

Inspection Standards

Major

PCB copper flakes peeling off

Any copper flake in viewing Area should be greater than 1.0mm2

Reject

Major

Height of coating epoxy

Exceed the dimension of drawing

Reject

Major

Void or hole of coating epoxy

Expose bonding wire or IC

Reject

Major

PCB cutting defect

Exceed the dimension of drawing

Reject

2.SMT

Defect

Inspection Item

Inspection Standards

Minor

Component marking not readable

 

Reject

Minor

Component height

Exceed the dimension
Of drawing

Reject

Major

Component solder defect (missing, extra, wrong component or wrong orientation

 

Reject

Minor

Component position shift
1.jpg

X < 3/4Z  Y > 1/3D

Reject  Reject

Minor

Component tilt
2.jpg

Y  > 1/3D

Reject

Minor

Insufficient solder
3.jpg

θ< 20°

Reject

9-4. Criteria (Continued)

3. Metal (Plastic) Frame

Defect

Inspection Item

Inspection Standards

Major

Crack / breakage

Anywhere

Reject

Minor

Frame Scratch

W

L

Acceptable of Scratch

w<0.03mm

Any

Ignore

0.03mm<w<0.05mm

L<5.0mm

2

0.05mm<w<0.1mm

L<3.0mm

1

w>0.1mm

Any

0

Note: 1. Above criteria applicable to scratch lines with distance greater than 5mm.
2. Scratch on the back side of frame (not visible) can be ignored.

Minor

Frame Dent, Prick
1.jpg

 

Acceptable of Dents / Pricks

Φ<1.0mm

2

1.0<Φ<1.5mm

1

1.5mm>Φ

0

Note: 1. Above criteria applicable to any two dents / pricks with distance greater than 5mm
2. Dent / prick on the back side of frame (not visible) can be ignored

Minor

Frame Deformation

Exceed the dimension of drawing

Minor

Metal Frame Oxidation

Any rust

4. Flexible Film Connector (FFC)

Defect

Inspection Item

Inspection Standards

Minor

Tilted soldering

Within the angle +3°

Acceptable

Minor

Uneven solder joint /bump

 

Reject

Minor

Hole

1.jpg

Expose the conductive line

Reject

Φ > 1.0mm

Reject

Minor

Position shift
2.jpg

Y > 1/3D

Reject

X > 1/2Z

Reject

9-4. Criteria (Continued)

5. Screw

Defect

Inspection Item

Inspection Standards

Major

Screw missing/loosen

 

Reject

Minor

Screw oxidation

Any rust

Reject

Minor

Screw deformation

Difficult to accept screw driver

Reject

6. Heat seal 、TCP 、FPC

Defect

Inspection Item

Inspection Standards

Major

Scratch expose conductive layer

 

Reject

Minor

HS Hole

1.jpg

Φ> 0.2mm

Reject

Major

Adhesion strength

Less than the specification

Reject

Minor

Position shift
2.jpg

Y > 1/3D

Reject

X > 1/2Z

Reject

Major

Conductive line break

 

Reject

7. LED Backing Protective Film and Others

Defect

Inspection Item

Inspection Standards

Minor

LED dirty, prick

Acceptable number of units

Φ<0.10mm

lgnore

0.10<Φ<0.15mm

2

0.15<Φ<0.2mm

1

Φ>0.2mm

0

The distance between any two spots should be >10mm
Any spot/dot/void outside of viewing area is acceptable

Minor

Protective film tilt

Not fully cover LCD

Reject

Major

COG coating

Not fully cover ITO circuit

Reject

8. Electric Inspection

Defect

Inspection Item

Inspection Standards

Major

Short

 

Reject

Major

Open

 

Reject

9-4. Criteria (Continued)

9.Inspection Specification of LCD

Defect

Inspect Item

Inspection Standards

Minor

Linear Defect

*Glass Scratch
*Polarizer Scratch
*Fiber and Linear material

W

W<0.03

0.03<W<0.05

W>0.05

L

L<5

L<3

Any

ACC. NO.

1

1

Reject

Note

L is the length and W is the width of the defect

Minor

Black Spot and Polarizer Pricked

*Foreign material between glass and polarizer or glass and glass
*Polarizer hole or protuberance by external force

Φ

Φ<0.1

0.1<Φ<0.15

0.15<Φ<0.2

Φ>0.2

ACC. NO.

3EA /1PC

2

1

0

Note

Φ is the average diameter of the defect.
Distance between two defects > 10mm.

Minor

White Spot and Bubble in polarizer

* Unobvious transparant foreign material between glass and glass or glass and polarizer
* Air protuberance between polarizer and glass

Φ

Φ<0.1

0.1<Φ<0.15

0.15<Φ<0.2

Φ>0.2

ACC. NO.

3EA / 1PC

2

1

0

Note

Φ is the average diameter of the defect.
Distance between two defects > 10mm.

Minor

Segment  Defect


1.jpg

Φ

Φ<0.10

0.10<Φ<0.20

Φ>0.2

ACC.NO.

3EA /1PC

2

0

Note

W is more than 1/2 segment width

Reject

5.jpg 
Distance between two defect is 10mm

Minor

Protuberant Segment

2.jpg

Φ

Φ<0.10

0.10<Φ<0.20

Φ>0.2

W

Glue

W<1/2 Seg , W<0.2

Ignore

ACC.NO.

3EA /1PC

2

0

Minor

Assembly
Mis-alignment

3.jpg

1. Segment

B

B<0.4mm

0.4<B<1.0mm

B>1.0mm

B-A

B-A<1/2B

B-A<0.2

B-A<0.25

Judge

Acceptable

Acceptable

Acceptable

4.jpg

2. Dot Matrix

Deformation>0.35mm

Reject

Minor

Stain on LCD Panel Surface

Accept when stains can be wiped lightly with a soft cloth or a similar one. Otherwise, judged according to the above items: “Black spot” and “White Spot”

10. RELIABILITY

NO.

Item

Condition

Criterion

1

High Temperature Operating

 70℃, 96Hrs

No defect in cosmetic and operational function allowable.

Total current Consumption should be below double of initial value.

2

Low Temperature Operating

 -20℃, 96Hrs

3

High Humidity

 60℃, 90%RH, 96Hrs

4

High Temperature Storage

 80℃, 96Hrs

5

Low Temperature Storage

 -30℃, 96Hrs

6

Vibration

 Random wave
10 ~ 100Hz
Acceleration: 2G
60 Minute

7

Thermal Shock

-20℃ to 25℃ to 70℃
(60Min)  (15Min)  (60Min)
16Cycles

8

ESD Testing

Contract Discharge Voltage:
+1 ~ 5kV and –1 ~ –5kV

There will be discharged ten times at every discharging voltage cycle. The voltage gap is 1kV.

Air Discharge Voltage:
+1 ~ 8kV and –1 ~ -8kV

Note:1) Above conditions are suitable for Amotec standard products.

2) For restrict products, the test conditions listed as above must be revised.

1.jpg

2.jpg

FAQ

1.What is a duty cycle ?

A duty cycle is the fraction of one period in which a signal or system is active. Duty cycle is commonly expressed as a percentage or a ratio. A period is the time it takes for a signal to complete an on-and-off cycle.

2.What is your monthly production capacity ?

Our monthly production capacity is about one million pieces modules.

3.WHAT IS THE MOQ (MINIMUM ORDER QUANTITY) OF CUSTOM LCDS?

MOQs (minimum order quantity) are determined by two factors:

* The type of technology and the size of the glass.

* The larger the glass area, the lower the MOQ.

4.Have you got Rohs complaint for your products ?

Answer:Yes, We provide full ROHS& REACH compliant products.

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